Frank is absolutely correct on the demand related to the amp chips (the point is avoiding clipping), but they are designed to go 4Ω ...See below.
Hitachi HA1392 Data Sheet Excerpt:
Conion C100 HA1392.jpg
HA1392 Amp Layout.jpg
The real question is the heat sink and components around it which allow it to breathe. See the heat sink on the photo below of the Conion/Helix and whatever other name it has.
dsc06989bvn.jpg
Look at the white stuff around the chip. Do you think it has solid contact with the heat sink and sufficiently, properly applied thermal paste across the entire chip? My two cents and common sense says no. This is where removal of the heat sink, cleaning of chip and heat sink, verification and adjustment of fit up is done, then application of fresh thermal transfer paste, and reassembly is done. I can tell you straight up that when I have a need to open mine up it's something I do as long as I'm in there. The paste WILL break down over time and heat cycles create gaps and air pockets. Or, depending on the makeup, become an oily residue similar to what happens when peanut butter loses it bond and you see the oil on top.
On another note, although it's not a gigantic heat sink, it is finned which is what you want versus some small plate of aluminum or steel seen in a great many boomers. Also check for loose connections and leaky caps. (If you look just above the phono/aux switch you'll see what I mean about the caps.)